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公司新闻

意法半导体和格芯将在法国新建12英寸晶圆厂，推进 FD-SOI 生态系统建设

意法半导体2022年第二季度财报和电话会议时间安排

Software République宣布智能安全可持续出行计划初战告捷

Metalenz and STMicroelectronics deliver world’s first optical metasurface technology for consumer electronics devices

STMicroelectronics inaugure avec Dalkia un dispositif innovant d’efficacité énergétique sur son site de Rousset

STMicroelectronics’ Annual General Meeting 2022

新加坡能源集团为意法半导体打造新加坡最大的工业区供冷系统

意法半导体于资本市场日公布目标200+亿美元营收计划纲要

NP Plastibell 展示基于意法半导体NFC技术的创新型互联注射器

意法半导体和亚马逊云科技合作开发安全的物联网AWS云连接方案

意法半导体与赛米控合作，在下一代电动汽车驱动系统中集成碳化硅功率技术

意法半导体发布第25份年度可持续发展报告

意法半导体公布2022年第一季度财报

CEA、Soitec、格芯和意法半导体合力推进下一代 FD-SOI技术发展规划

意法半导体公布2022年一季度财报、电话会议和资本市场日的时间安排

STMicroelectronics and SEONG JI INDUSTRIAL announce new LPWA module using STM32 wireless microcontroller

STMicroelectronics Reports on Resolutions to be Proposed at the 2022 Annual General Meeting of Shareholders

Wacom、意法半导体和 CEVA 合作提升数字笔使用体验

STMicroelectronics Announces Publication of IFRS 2021 Annual Report And Dividend Proposal

Software République 启动创业孵化器计划，加快可持续安全智能出行发展

意大利和法国：欧洲投资银行向意法半导体提供 6 亿欧元贷款，加强欧洲半导体产业实力

意法半导体荣登“2022全球创新百强企业”榜单

STMicroelectronics Publishes its 2021 Annual Report Form 20-F

意法半导体公布2021年四季度及全年财报

STMicroelectronics Italia certificata Top Employer Italia 2022

STMicroelectronics France reçoit la certification « Top Employer France » 2022

STMicroelectronics Announces Status of Common Share Repurchase Program

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意法半导体和格芯将在法国新建12英寸晶圆厂，推进 FD-SOI 生态系统建设

意法半导体2022年第二季度财报和电话会议时间安排

Software République宣布智能安全可持续出行计划初战告捷

Metalenz and STMicroelectronics deliver world’s first optical metasurface technology for consumer electronics devices

STMicroelectronics inaugure avec Dalkia un dispositif innovant d’efficacité énergétique sur son site de Rousset

STMicroelectronics’ Annual General Meeting 2022

新加坡能源集团为意法半导体打造新加坡最大的工业区供冷系统

意法半导体于资本市场日公布目标200+亿美元营收计划纲要

NP Plastibell 展示基于意法半导体NFC技术的创新型互联注射器

意法半导体和亚马逊云科技合作开发安全的物联网AWS云连接方案

意法半导体与赛米控合作，在下一代电动汽车驱动系统中集成碳化硅功率技术

意法半导体发布第25份年度可持续发展报告

意法半导体公布2022年第一季度财报

CEA、Soitec、格芯和意法半导体合力推进下一代 FD-SOI技术发展规划

意法半导体公布2022年一季度财报、电话会议和资本市场日的时间安排

STMicroelectronics and SEONG JI INDUSTRIAL announce new LPWA module using STM32 wireless microcontroller

STMicroelectronics Reports on Resolutions to be Proposed at the 2022 Annual General Meeting of Shareholders

Wacom、意法半导体和 CEVA 合作提升数字笔使用体验

STMicroelectronics Announces Publication of IFRS 2021 Annual Report And Dividend Proposal

Software République 启动创业孵化器计划，加快可持续安全智能出行发展

意大利和法国：欧洲投资银行向意法半导体提供 6 亿欧元贷款，加强欧洲半导体产业实力

意法半导体荣登“2022全球创新百强企业”榜单

STMicroelectronics Publishes its 2021 Annual Report Form 20-F

意法半导体公布2021年四季度及全年财报

STMicroelectronics Italia certificata Top Employer Italia 2022

STMicroelectronics France reçoit la certification « Top Employer France » 2022

STMicroelectronics Announces Status of Common Share Repurchase Program

更多内容，敬请期待

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