STMicroelectronics at electronica China 2024: Cutting-edge technologies and innovative solutions for Automotive, Industrial, Personal Electronics and Cloud Infrastructure
Media Relations
Fiona ZHU
STMicroelectronics
Tel: +86 10 5797 9343
fiona.zhu@st.com
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STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, will exhibit at electronica China 2024(Booth E4.4600)on8-10 July. Under the theme of “Our technology starts with You”, ST will showcase a comprehensive portfolio of innovative solutions across Automotive, Industrial, Personal Electronics and Cloud Infrastructure, featuring over 50 interactive demos and advanced solutions, each tailored to meet the evolving needs of our customers and the market.
Automotive: With over 30 years’ experience in automotive electronics, ST is a reliable and innovative partner for building the future of smart e-mobility. ST’s comprehensive solutions span the e-mobility value chain. From electric powertrains to digital vehicle platforms, ST technologies make electric transportation safer, cleaner, and more advanced. At electronica China, ST will demonstrate its complete automotive solutions by showcasing two electric-vehicle models. Visitors can explore ST’s wide range of applications for car electrification and digitalization, from Powertrain for Electric Vehicles (EV), Chassis and Safety, Body and Convenience, to Telematics and Infotainment.
Electrification is a major development trend in China’s automotive market, with a prosperous growth in the NEV (new energy vehicle) market segment, accompanied by an increasing demand for convenient NEV charging solutions. ST’s latest automotive-charging solution integrates On Board Charger (OBC) and DC-DC converter built with STPOWER products enabling compatibility with different power levels like 6.6kW, 11kW, or even 22kW. It features ST’s Stellar E1 40nm microcontroller technology based on the ARM® architecture, delivering high efficiency and reliability through high and flexible power computing cores with rich analog components and the highest functional safety level.
Another innovation ST will showcase at electronica China is the ADAS – Intelligent Front View Camera Solution, developed in collaboration with ST’s partners. This solution incorporates a range of ST’s technologies, including the SPC58NN automotive MCU and the L9396 System Basis Chip (SBC). The combination of an MCU and an SBC enables customers to meet the stringent safety requirements of ASIL-D when creating advanced ADAS products.
Industrial: With increasing concerns around climate change and energy costs, stakeholders, such as states, companies, and individuals, globally are prioritizing green-energy sustainable practices. ST is at the forefront of driving a greener future by developing sustainable solutions in a sustainable way. At electronica China, visitors are invited to witness a one-of-a-kind “energy-wall” that shows a comprehensive hybrid energy system. It illustrates the entire energy-conversion chain, from generation and storage to distribution and consumption, through various components and devices including PV solar panels, inverters, a Battery Management System (BMS), a bi-directional energy-storage system, and EV charging systems.
Reliable and efficient power is critical for datacenters supporting AI/cloud workloads. Using its cutting-edge technologies such as STPOWER Gen3 SiC MOSFETs and silicon transistors (i.e. high voltage MOSFETs and IGBTs), galvanic isolation gate drivers, high precision op amps, current sensing amplifiers, and high-performance MCUs, ST showcases solutions that aim to boost energy efficiency while cutting consumption and carbon emissions.
Arc Fault Circuit Interrupter (AFCI) has been widely applied in new energy industries such as photovoltaics and energy storage. At electronica China, ST will present its AFCI solution, which leverages edge-AI algorithms based on the STM32H7 and STM32G4 MCUs to detect arc faults in real time. Compared to traditional mechanistic algorithms, the AI algorithm integrated with the STM32 technology offers significantly higher accuracy and reduced false-alarm rates. The data training from a customer on-site and the upgrading of the STM32 AFCI 2.0 algorithm can lead to higher accuracy in the inference results.
Personal Electronics and Cloud Infrastructure: With the widespread adoption of NFC functionality in smartphones in recent years, an increasing number of brands are leveraging NFC to enhance consumer interaction and brand loyalty. High-end brands, high-value products, including luxury goods and artworks, require more secure NFC tag solutions to prevent counterfeiting. At this exhibition, ST also introduces its latest ST25TA-E NFC tag chip with state-of-the-art security features bringing innovation to the market with its on-chip ECDSA (Elliptic Curve Digital Signature Algorithm) capabilities and compatibility with Blockchain standards. Building on the Edge TruST25 digital-signature feature, the ST25TA-E includes an ECC cryptographic engine, providing a more secure digital-signature solution that can offer significant assistance in product-identity verification and digital twinning.
Showcased at electronica China, ST’s new third-generation duel full-scale MEMS pressure sensor comes in a sealed, cylindrical, surface-mountable package. The sensor is demoed in a solution that combines high precision and low power consumption to accurately measure water depth and altitude for IoT, sports, and wearable-device applications. It features a ceramic substrate that provides high resistance to liquid permeability and a robust potting gel, proven in automotive applications, to protect the internal circuitry.
Improving user experience is key to driving ST’s continuous innovation. Powered by ST FlightSense Time-of-Flight technology, a smart-cup detection shown at electronica China can detect and measure cups of various sizes, shapes, and materials, as well as their positions and the liquid level inside, thanks to the Compact Normalized Histograms feature. With this technology, users can use cups of any size and shape without worrying about spills due to poor fit.
A binocular 3D camera will be on show using one of our ST BrightSense global-shutter image sensors, which have just been launched on the open-market, to make this unique technology available to all, after having delivered > 1Bu image sensors to selected partners.
Presentations:
In addition to exciting demonstrations, ST’s experts will take the stage at electronica China to deliver 6 insightful presentations. These sessions will span a wide array of cutting-edge topics, offering deep dives into the latest trends and innovations that are shaping the future of technology:
- ST’s Edge AI Solutions
- ST’s Silicon Carbide MOSFET Technology Roadmap and Market Strategy in China
- ST motor control development ecosystem and system solution introduction
- The Solution of Intelligent Driving
- STM32 Solution in Digital Power and ESS
- Bluetooth LE Audio – Auracast™ with STM32WBA55
For an in-depth exploration of these captivating demonstrations, please visit ST’s booth (Booth E4.4600)at electronica China 2024. You can also check some of our use-case solutions at our event page.
About STMicroelectronics
At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
Media Relations
Fiona ZHU
STMicroelectronics
Tel: +86 10 5797 9343
fiona.zhu@st.com
Stay tuned
To receive frequent updates via email, subscribe to our press releases.